magnifying icon Basket
1 item ^

Basket is empty
Login

Login

LOGGED AS

Help

Satisfaction enquiry

SATISFACTION ENQUIRY

Newsletter

Free of charge lifelong learning "Standardization"

FREE OF CHARGE LIFELONG LEARNING "STANDARDIZATION"

Standardisation

Draft standards in public enquiry

DRAFT STANDARDS IN PUBLIC ENQUIRY

Standards organizations

STANDARDS ORGANIZATIONS

  • National standards

  • European standards

  • International standards


Search Results

Back to search form
sorted by Results per page
Result(s) 1 - 10 of 33 1 2 3 4
 
Free preview
Price
Language
 
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
TC/SC : CLC/SR 91
Status : Standard  -  Active
  •  
  • 67.3
  •  

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of an assembly by thermal transient method
TC/SC : CLC/SR 91
Status : Standard  -  Active
  •  
  • 34
  •  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA
TC/SC : CLC/SR 91
Status : Standard  -  Active
  •  
  • 19.2
  •  

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
TC/SC : CLC/SR 91
Status : Standard  -  Active
  •  
  • 40
  •  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-501: Test methods for materials for interconnection structures - Measurement of resilience strength and resilience strength retention factor of flexible dielectric materials
TC/SC : CLC/SR 91
Status : Standard  -  Active
  •  
  • 25.3
  •  

Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity
TC/SC : CLC/SR 91
Status : Standard  -  Active
  •  
  • 23.9
  •  

Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad
TC/SC : CLC/SR 91
Status : Standard  -  Active
  •  
  •  
  •  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
TC/SC : CLC/SR 91
Status : Standard  -  Active
  •  
  • 59.3
  •  

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
TC/SC : CLC/SR 91
Status : Standard  -  Active
  •  
  • 25.3
  •  

Materials for printed boards and other interconnecting structures - Part 2-51: Reinforced base materials, clad and unclad - Base materials for integrated circuit card carrier tape, unclad
TC/SC : CLC/SR 91
Status : Standard  -  Active
  •  
  • 28.5
  •  

 
Result(s) 1 - 10 of 33 1 2 3 4
Back to search form Back to top

magnifying icon Basket
1 item ^

Basket is empty


Warning:
DIN standards can be downloaded only once! After downloading, they are no longer available in the eLibrary.
Begin download?