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IEC 61182-2-2 Ed. 1.0 Edition 04/2012
Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
TC/SC : 91
Status : Norm  -  Aktiv
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  • € 238.3
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IEC 61249-2-34 Ed. 1.0 Edition 02/2009
Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
TC/SC : 91
Status : Norm  -  Aktiv
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IEC 61249-2-37 Ed. 1.0 Edition 11/2008
Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
TC/SC : 91
Status : Norm  -  Aktiv
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IEC 61249-5-4 Ed. 1.0 Edition 06/1996
Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
TC/SC : 91
Status : Norm  -  Aktiv
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  • € 70.6
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IEC 61249-2-9 Ed. 1.0 Edition 02/2003
Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
TC/SC : 91
Status : Norm  -  Aktiv
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IEC 61249-3-5 fF Ed. 1.0 Edition
Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
TC/SC : 91
Status : Norm  -  Aktiv
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IEC 62243 Ed. 2.0 Edition 06/2012
Artificial Intelligence Exchange and Service Tie to All Test Environments (AI-ESTATE)
TC/SC : 91
Status : Norm  -  Aktiv
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IEC 62526 Ed. 1.0 Edition 11/2007
Standard for Extensions to Standard Test Interface Language (STIL) for Semiconductor Design Environments
TC/SC : 91
Status : Norm  -  Aktiv
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IEC 61190-1-1 Ed. 1.0 Edition 03/2002
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
TC/SC : 91
Status : Norm  -  Aktiv
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IEC 61192-5 Ed. 1.0 Edition 05/2007
Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
TC/SC : 91
Status : Norm  -  Aktiv
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