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Nationale Normen
Europäische Normen
Internationale Normen
IEC 61189-5-601:2021 specifies the reflow soldering ability test method for components mounted on organic rigid printed boards, the reflow heat resistance test method for organic rigid printed boards, and the reflow soldering ability test method for the lands of organic rigid printed boards in applications using solder alloys, which are eutectic or near-eutectic tin-lead (Pb), or lead-free alloys.
The printed boards materials for this organic rigid printed boards are epoxide woven E-glass laminated sheets that are specified in IEC 61249-2 (all parts).
The objective of this document is to ensure the soldering ability of the solder joint and of the lands of the printed boards. In addition, test methods are provided to ensure that the printed boards can resist the heat load to which they are exposed during soldering.
| Standard - Aktiv |
| Technisches Komitee : |
| 91 : Electronics assembly technology |
| Beginn der Abstimmung über den Entwurf | Datum der Ratifizierung (dor) | |||||
| Ende der Abstimmung über den Entwurf | Datum der Ankündigung (doa) | |||||
| Beginn der Abstimmung über den Schlussentwurf | Datum der Veröffentlichung (dop) | |||||
| Ende der Abstimmung über den Schlussentwurf | Datum der Zurückziehung (dow) |
|
Veröffentlichung im Amtsblatt
des Grossherzogtum Luxemburg |
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| Referenz |
| 31.180 : Printed circuits and boards |
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