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prEN IEC 61189-2-809:2022 Edition 03/2024
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-809: X/y coefficient of thermal expansion test (CTE) for thick base materials by TMA
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Status

Draft - Active

Origin

Technical Committee :
CLC/SR 91 : Electronics assembly technology

Implementation

start of the vote on the project    12/08/2022   date of ratification (dor)    02/01/2024
end of the vote on the project    04/11/2022   date of anouncement (doa)    04/06/2024
start of the vote on the final project    20/10/2023   date of publication (dop)    04/09/2024
end of the vote on the final project    01/12/2023   date of withdrawal (dow)    04/09/2024


Publication Official Journal
of the Grand-Duchy of Luxembourg
Reference

Relations

Relations to international standards
IEC 61189-2-809 ED1 

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