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ILNAS-EN IEC 60749-5:2024 Edition 01/2024
Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
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Abstract

IEC 60749-5:2023 is available as IEC 60749-5:2023 RLV which contains the International Standard and its Redline version, showing all changes of the technical content compared to the previous edition.

IEC 60749-5:2023 provides a steady-state temperature and humidity bias life test to evaluate the reliability of non-hermetic packaged semiconductor devices in humid environments. This test method is considered destructive. This edition includes the following significant technical changes with respect to the previous edition: a) The specification of the test equipment is changed to require the need to minimize relative humidity gradients and maximize air flow between semiconductor devices under test; b) The specification of the test equipment fixtures is changed to require the avoidance of condensation on devices under test and on electrical fixtures connecting the devices to the test equipment; c) replacement of references to “virtual junction” with “die”.

Status

Standard - Active

Origin

Technical Committee :
CLC/SR 47 : Semiconductor devices

Implementation

start of the vote on the project    09/09/2022   date of ratification (dor)    23/01/2024
end of the vote on the project    02/12/2022   date of anouncement (doa)    23/04/2024
start of the vote on the final project    29/09/2023   date of publication (dop)    23/10/2024
end of the vote on the final project    10/11/2023   date of withdrawal (dow)    23/01/2027


Publication Official Journal
of the Grand-Duchy of Luxembourg
Reference

Relations

Relations to older standards
ILNAS-EN 60749-5:2017

Relations to international standards
IEC 60749-5 ED3 
IEC 60749-5:2023 

International Classification for Standards (ICS codes) :

31.080.01 : Semiconductor devices in general

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