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Language
prEN IEC 61188-6-3:2023
Edition
03/2025
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)

Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
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Status
Draft - Active | |
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Origin
Technical Committee : |
CLC/SR 91 : Electronics assembly technology |
Implementation
start of the vote on the project | 25/08/2023 | date of ratification (dor) | 16/01/2025 | |||
end of the vote on the project | 17/11/2023 | date of anouncement (doa) | 17/06/2025 | |||
start of the vote on the final project | 04/11/2024 | date of publication (dop) | 17/09/2025 | |||
end of the vote on the final project | 16/12/2024 | date of withdrawal (dow) | 17/09/2025 |
Publication Official Journal
of the Grand-Duchy of Luxembourg |
|
Reference |
Relations
Relations to international standards |
IEC 61188-6-3 ED1 |