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prEN IEC 61188-6-3:2023 Edition 03/2025
Circuit boards and circuit board assemblies - Design and use - Part 6-3: Land pattern design - Description of land pattern for through hole components (THT)
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Draft - Active
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Origin

Technical Committee :
CLC/SR 91 : Electronics assembly technology

Implementation

start of the vote on the project    25/08/2023   date of ratification (dor)    16/01/2025
end of the vote on the project    17/11/2023   date of anouncement (doa)    17/06/2025
start of the vote on the final project    04/11/2024   date of publication (dop)    17/09/2025
end of the vote on the final project    16/12/2024   date of withdrawal (dow)    17/09/2025


Publication Official Journal
of the Grand-Duchy of Luxembourg
Reference

Relations

Relations to international standards
IEC 61188-6-3 ED1 

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