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IEC 62878-2-603 Ed.1.0
Edition
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
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Status
| Draft - Active | |
| If you have any comments on this standard in public inquiry, you can submit them by filling out the commenting form . |
Origin
| Technical Committee : |
| 91 : Electronics assembly technology |
Implementation
| start of the vote on the project | 20/10/2023 | date of ratification (dor) | ||||
| end of the vote on the project | 20/12/2023 | date of anouncement (doa) | ||||
| start of the vote on the final project | date of publication (dop) | |||||
| end of the vote on the final project | date of withdrawal (dow) |
|
Publication Official Journal
of the Grand-Duchy of Luxembourg |
|
| Reference |
