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IEC 60068-2-58 Ed. 3.0 Edition 07/2004
Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
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Abstract

This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD), which are intended to mount on substrates. This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys. This standard provides standard procedures for determining the solderability and resistance of soldering heat to lead-free solder alloys. This standard provides standard procedures for determining the solderability, dissolution of metallization and resistance of soldering heat to solder alloys which are eutectic or near eutectic tin lead solders.

Status

Standard - Active

Origin

Technical Committee :
91 : Electronics assembly technology

Implementation

start of the vote on the project      date of ratification (dor)   
end of the vote on the project      date of anouncement (doa)   
start of the vote on the final project      date of publication (dop)   
end of the vote on the final project      date of withdrawal (dow)   


Publication Official Journal
of the Grand-Duchy of Luxembourg
Reference

Relations

Evolutions
IEC 60947-2 Ed. 4.2

International Classification for Standards (ICS codes) :

19.040 : Environmental testing
31.190 : Electronic component assemblies

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