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IEC 60749-9 Ed. 1.0 Edition 04/2002
Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
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Abstract

Aims at testing and verifying that the markings on semiconductor devices will not become illegible when subject to solvents or cleaning solutions commonly used during the removal of solder flux residue from the printed circuit board assembly process. This test is applicable for all package types. The test should be considered non-destructive. The contents of the corrigendum of August 2003 have been included in this copy.

Status

Standard - Active

Origin

Technical Committee :
47 : Semiconductor devices

Implementation

start of the vote on the project      date of ratification (dor)   
end of the vote on the project      date of anouncement (doa)   
start of the vote on the final project      date of publication (dop)   
end of the vote on the final project      date of withdrawal (dow)   


Publication Official Journal
of the Grand-Duchy of Luxembourg
Reference

Relations

Evolutions
IEC 60947-2 Ed. 4.2

Relations to older standards
IEC 60749 Ed. 2.0

International Classification for Standards (ICS codes) :

31.080.01 : Semiconductor devices in general

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