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IEC 61191-3 Ed. 1.0 Edition 08/1998
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
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  • 70.6 / copy
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Abstract

Prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Status

Standard - Active

Origin

Technical Committee :
91 : Electronics assembly technology

Implementation

start of the vote on the project      date of ratification (dor)   
end of the vote on the project      date of anouncement (doa)   
start of the vote on the final project      date of publication (dop)   
end of the vote on the final project      date of withdrawal (dow)   


Publication Official Journal
of the Grand-Duchy of Luxembourg
Reference

Relations

Evolutions
IEC 60947-2 Ed. 4.2

International Classification for Standards (ICS codes) :

31.240 : Mechanical structures for electronic equipment

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