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IEC 61191-1 Ed.3.0 Edition 09/2018
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
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  • 268.3 / copy
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Abstract

IEC 61191-1:2018 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes. This edition includes the following significant technical changes with respect to the previous edition:
- the requirements have been updated to be compliant with the acceptance criteria in IPC‑A-610F;
- the term "assembly drawing" has been changed to "assembly documentation" throughout;
- references to IEC standards have been corrected;
- Clause 9 was completely rewritten;
- Annex B was removed because there are already procedures for circuit board assemblies.

Status

Standard - Active

Origin

Technical Committee :
91 : Electronics assembly technology

Implementation

start of the vote on the project      date of ratification (dor)   
end of the vote on the project      date of anouncement (doa)   
start of the vote on the final project      date of publication (dop)   
end of the vote on the final project      date of withdrawal (dow)   


Publication Official Journal
of the Grand-Duchy of Luxembourg
Reference

Relations

Relations to older standards
IEC 61191-1 Ed.2.0

International Classification for Standards (ICS codes) :

31.190 : Electronic component assemblies
31.240 : Mechanical structures for electronic equipment

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