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IEC 62878-2-5 Ed.1.0 Edition 09/2019
Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate
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  • 304.6 / copy
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Abstract

IEC 62878-2-5:2019 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.
This data format is to be used for simulation (e.g. stress, thermal, EMC), tooling, manufacturing, assembly, and inspection requirements. Furthermore, the data format is used for transferring information among printed board designers, printed board simulation engineer, manufacturers, and assemblers.
IEC 62878-2-5:2019 applies to substrates using organic material. It neither applies to the re-distribution layer (RDL) nor to the electronic modules defined as M-type business model in IEC 62421.

Status

Standard - Active

Origin

Technical Committee :
91 : Electronics assembly technology

Implementation

start of the vote on the project      date of ratification (dor)   
end of the vote on the project      date of anouncement (doa)   
start of the vote on the final project      date of publication (dop)   
end of the vote on the final project      date of withdrawal (dow)   


Publication Official Journal
of the Grand-Duchy of Luxembourg
Reference

Relations

Relations to older standards
IEC/PAS 62878-2-5 Ed. 1.0
IEC/PAS 62878-2-5 Ed. 1.0

International Classification for Standards (ICS codes) :

31.180 : Printed circuits and boards
31.190 : Electronic component assemblies

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