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IEC 63055 Ed.2.0 Edition 10/2023
Format for LSI-Package-Board Interoperable design
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  • 432 / copy
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Abstract

IEC 63055:2023 defines a common interoperable format that will be used for the design of a) large-scale integration (LSI), b) packages for such LSI, and c) printed circuit boards on which the packaged LSIs are interconnected. Collectively, such designs are referred to as LSI-Package-Board (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This is an IEC/IEEE dual logo standard.

Status

Standard - Active

Origin

Technical Committee :
91 : Electronics assembly technology

Implementation

start of the vote on the project      date of ratification (dor)   
end of the vote on the project      date of anouncement (doa)   
start of the vote on the final project      date of publication (dop)   
end of the vote on the final project      date of withdrawal (dow)   


Publication Official Journal
of the Grand-Duchy of Luxembourg
Reference

Relations

Relations to older standards
IEC 63055 Ed. 1.0

International Classification for Standards (ICS codes) :

31.180 : Printed circuits and boards
31.200 : Integrated circuits. Microelectronics
35.060 : Languages used in information technology

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