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IEC 61189-5-601 Ed.1.0 Edition
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
At present no electronic version for this standard online.
Please feel free to contact normalisation@ilnas.etat.lu
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Status

Draft - Active

Origin

Technical Committee :
91 : AUTO ADDED for 91(1286)

Implementation

start of the vote on the project    13/09/2019   date of ratification (dor)   
end of the vote on the project    13/11/2019   date of anouncement (doa)   
start of the vote on the final project      date of publication (dop)   
end of the vote on the final project      date of withdrawal (dow)   


Publication Official Journal
of the Grand-Duchy of Luxembourg
Reference

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