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IEC 61760-1 Ed. 2.0 Edition 04/2006
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
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  • 167.7 / copy
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Abstract

IEC 61760-1:2006-04(en-fr) gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology. The main changes with regard to the previous edition concern:
- requirements related to lead-free soldering;
- extension of the scope to include also components mounted by gluing;
- direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat;
- classification into categories based on the component's ability to withstand resistance to soldering heat has been deleted.

Status

Standard - Withdrawn

Origin

Technical Committee :
91 : Electronics assembly technology

Implementation

start of the vote on the project      date of ratification (dor)   
end of the vote on the project      date of anouncement (doa)   
start of the vote on the final project      date of publication (dop)   
end of the vote on the final project      date of withdrawal (dow)   


Publication Official Journal
of the Grand-Duchy of Luxembourg
Reference

Relations

Evolutions
IEC 61760-1 Ed.3.0
IEC 61760-1 Ed.3.0

International Classification for Standards (ICS codes) :

31.240 : Mechanical structures for electronic equipment

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