Abstract
Gives recommendations applying to tape automated bonding (TAB) of integrated circuits. Dimension values or requirements given in this standard for tape width, perforations, test pattern, outer lead bonding (OLB), etc., correspond to the state of the market at the date of edition of this standard. More especially, tape width and perforation dimensions have been derived from motion picture film standards.
Progress in integrated circuit (IC) technology resulting in a higher number of terminals and user requirements may lead in the future to additional or new dimensions.
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