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Standardisation

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IEC 60191-6-12 Ed. 1.0 Edition 06/2002
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type
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  • 104.6 / copy
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Abstract

Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid array whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is rectangular.

Status

Standard - Superseded

Origin

Technical Committee :
47D : Semiconductor devices packaging

Implementation

start of the vote on the project      date of ratification (dor)   
end of the vote on the project      date of anouncement (doa)   
start of the vote on the final project      date of publication (dop)   
end of the vote on the final project      date of withdrawal (dow)   


Publication Official Journal
of the Grand-Duchy of Luxembourg
Reference

Relations

Evolutions
IEC 60951-3 Ed.3.0 RLV

International Classification for Standards (ICS codes) :

31.080.01 : Semiconductor devices in general

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