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IEC 60749-20 Ed. 2.0 Edition 12/2008
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
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  • 191 / copy
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Abstract

IEC 60749-20:2008 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive. This second edition cancels and replaces the first edition published in 2002 and constitutes a technical revision. The main changes are as follows:
- to reconcile certain classifications of IEC 60749-20 and those of IPC/JEDEC J-STD-020C;
- reference IEC 60749-35 instead of Annex A of IEC 60749-20, Edition 1;
- update for lead-free solder;
- correct certain errors in the original Edition 1.

Status

Standard - Active

Origin

Technical Committee :
47 : Semiconductor devices

Implementation

start of the vote on the project      date of ratification (dor)   
end of the vote on the project      date of anouncement (doa)   
start of the vote on the final project      date of publication (dop)   
end of the vote on the final project      date of withdrawal (dow)   


Publication Official Journal
of the Grand-Duchy of Luxembourg
Reference

Relations

Evolutions
IEC 60951-3 Ed.3.0 RLV
IEC 60749-20 Ed.3.0

Relations to older standards
IEC 60749-20 Ed. 1.0

International Classification for Standards (ICS codes) :

31.080.01 : Semiconductor devices in general

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