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IEC 61189-2 Ed. 1.0 Edition 04/1997
Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
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  • 345.6 / copy
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Abstract

Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies. It mainly covers mechanical and environmental test methods.

Status

Standard - Superseded

Origin

Technical Committee :
91 : Electronics assembly technology

Implementation

start of the vote on the project      date of ratification (dor)   
end of the vote on the project      date of anouncement (doa)   
start of the vote on the final project      date of publication (dop)   
end of the vote on the final project      date of withdrawal (dow)   


Publication Official Journal
of the Grand-Duchy of Luxembourg
Reference

Relations

Evolutions
IEC 60951-3 Ed.3.0 RLV

Relations to older standards
IEC 60249-1 am4 Ed. 2.0
IEC 60249-1 Ed. 2.0

International Classification for Standards (ICS codes) :

31.180 : Printed circuits and boards

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