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Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
TC/SC : 91
Status : Standard  -  Active

At present no electronic version for this standard online for following language version(s) : DE, FR .
Please feel free to contact normalisation@ilnas.etat.lu
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  • 55.10
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Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
TC/SC : 91
Status : Standard  -  Active

At present no electronic version for this standard online for following language version(s) : EN, DE, FR .
Please feel free to contact normalisation@ilnas.etat.lu
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  • 82.50
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Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
TC/SC : 91
Status : Standard  -  Active

At present no electronic version for this standard online for following language version(s) : EN, DE, FR .
Please feel free to contact normalisation@ilnas.etat.lu
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  • 192.60
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Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
TC/SC : 91
Status : Standard  -  Active

At present no electronic version for this standard online for following language version(s) : EN, DE, FR .
Please feel free to contact normalisation@ilnas.etat.lu
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Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
TC/SC : 91
Status : Standard  -  Active

At present no electronic version for this standard online for following language version(s) : EN, DE, FR .
Please feel free to contact normalisation@ilnas.etat.lu
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Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
TC/SC : 91
Status : Standard  -  Active

At present no electronic version for this standard online for following language version(s) : EN, DE, FR .
Please feel free to contact normalisation@ilnas.etat.lu
  •  
  • 55.10
  •  

Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
TC/SC : 91
Status : Standard  -  Active

At present no electronic version for this standard online for following language version(s) : EN, DE, FR .
Please feel free to contact normalisation@ilnas.etat.lu
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Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
TC/SC : 91
Status : Standard  -  Active

At present no electronic version for this standard online.
Please feel free to contact normalisation@ilnas.etat.lu
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  •  
  •  

IEC 62243 Ed. 2.0 Edition 06/2012
Artificial Intelligence Exchange and Service Tie to All Test Environments (AI-ESTATE)
TC/SC : 91
Status : Standard  -  Active

At present no electronic version for this standard online for following language version(s) : DE, FR .
Please feel free to contact normalisation@ilnas.etat.lu
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IEC 62526 Ed. 1.0 Edition 11/2007
Standard for Extensions to Standard Test Interface Language (STIL) for Semiconductor Design Environments
TC/SC : 91
Status : Standard  -  Active

At present no electronic version for this standard online for following language version(s) : DE, FR .
Please feel free to contact normalisation@ilnas.etat.lu
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Result(s) 1 - 10 of 237 1 2 3 4 5 ... 24
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