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Result(s) 1 - 10 of 309 1 2 3 4 5 ... 31
 
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Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
TC/SC : 91
Status : Standard  -  Active
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  • 72.3
  •  

Device embedded substrate - Part 2-2: Guidelines - Electrical testing
TC/SC : 91
Status : Standard  -  Active
  •  
  • 72.3
  •  

IEC 63004 Ed. 1.0 Edition 12/2015
Standard for receiver fixture interface
TC/SC : 91
Status : Standard  -  Active
  •  
  • 370.3
  •  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
TC/SC : 91
Status : Standard  -  Active
  •  
  • 225.8
  •  

Device embedding assembly technology - Part 2-603: Guideline for stacked electronic module - Test method of intra-module electrical connectivity
TC/SC : 91
Status : Standard  -  Active
  •  
  • 72.3
  •  

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
TC/SC : 91
Status : Standard  -  Active
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  •  

Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
TC/SC : 91
Status : Standard  -  Active
  •  
  • 72.3
  •  

Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
TC/SC : 91
Status : Standard  -  Active
  •  
  • 252.9
  •  

Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
TC/SC : 91
Status : Standard  -  Active
  •  
  • 140
  •  

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
TC/SC : 91
Status : Standard  -  Active
  •  
  • 72.3
  •  

 
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