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IEC 60749-34 Ed. 1.0 Edition 03/2004
Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling
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Abstract

Used to determine the resistance of a semiconductor device to thermal and mechanical stresses due to cycling the power dissipation of the internal semiconductor die and internal connectors. This happens when low-voltage operating biases for forward conduction (load currents) are periodically applied and removed causing rapid changes of temperature. The power cycling test is complementary to high temperature operating life.

Status

Standard - Superseded

Origin

Technical Committee :
47 : Semiconductor devices

Implementation

start of the vote on the project      date of ratification (dor)   
end of the vote on the project      date of anouncement (doa)   
start of the vote on the final project      date of publication (dop)   
end of the vote on the final project      date of withdrawal (dow)   


Publication Official Journal
of the Grand-Duchy of Luxembourg
Reference

Relations

Evolutions
IEC 60951-3 Ed.3.0 RLV
IEC 60951-3 Ed.3.0 RLV

Relations to older standards
IEC/PAS 62206 Ed. 1.0

International Classification for Standards (ICS codes) :

31.080 : Semiconductor devices

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